Researchers in the Smart Systems Integration Group have developed a tiny module that can be assembled in an electronic system or product and can monitor the main causes of product failure: thermal and mechanical stress, shock and vibration, and humidity. The module, a cube measuring less than 10mm on a side, can measure in three dimensions and can be assembled as a component on a conventional circuit board or moulded into a system-in-a-package. The data from the module can be used for reliability prognostics – the real-time monitoring and forecasting of reliability. It is especially intended for safety critical and high reliability systems where early warning of potential failure is important. Prototypes of the module have been successfully tested and work is now focussing on more extensive electrical and reliability testing.